Microtechnology packaging refers to an advanced technique called multi-chip "system in package," where two or more chips are put through a thinning process and stacked as a single unit or package, enabling higher performance in less space.
As a packaging technician, you'll work in laser fabrication, providing technical assistance to micro- and nanotechnology engineers in the manufacturing of integrated circuits, microelectronic devices, sensors, and electro-optic devices.
Tasks may include:
- Wire bonding
- Package sealing
- Setting up, operating, and maintaining equipment
- Providing technical assistance
Degree Requirements:
Minimum two-year degree in microtechnology, nanotechnology, or related field
Skills Required:
- Ability to work as part of a team
- Solid understanding of microelectronics
- Knowledge of assembly technology
- Understanding of electronic interconnections